EP3SE110F780I3N vs EP3SE110F780I3 Comparison

Detailed side-by-side comparison of EP3SE110F780I3N by Intel and EP3SE110F780I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE110F780I3N EP3SE110F780I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $1,950.00 $1,395.00
Family Stratix III E Stratix III E
Logic Elements 107,500 107500
Logic Array Blocks (LABs) 4,300 β€”
Embedded Memory Bits 8,936,448 (approximately 1.1 MB) β€”
Maximum User I/Os 488 β€”
Core Voltage 1.1 V (range 1.05 V to 1.15 V) β€”
Process Technology 65 nm CMOS 65 nm
Package 780-pin FC-FBGA (Flip-Chip FineLine BGA) β€”
Operating Temperature -40 Β°C to +100 Β°C (Industrial, "I" grade) -40C to +100C (industrial)
Configuration Interface Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) β€”
Boundary-Scan Test Yes, per IEEE Std. 1149.1 β€”
Speed Grade 3 (Fast) β€”
PLLs Yes, with global and regional clock networks β€”
Mounting Type Surface Mount (BGA) Surface Mount
RoHS Status Compliant unknown
MSL Level [DATA_NEEDED: MSL level] β€”
Supply Voltage Tolerance 1.05 V to 1.15 V β€”
Number of LABs/CLBs β€” 4300
Number of Logic Elements/Cells β€” 107500
Total RAM Bits β€” 8936448
Number of I/O β€” 488
Voltage - Supply β€” 1.1 V core
Package / Case β€” 780-BBGA, FCBGA (FineLine BGA)
Supplier Device Package β€” 780-FBGA
Moisture Sensitivity Level (MSL) β€” unknown
Grade β€” Industrial

Datasheets & Resources

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