EP3SE260F1517C4N vs EP3SE260F1517I3N Comparison
Detailed side-by-side comparison of EP3SE260F1517C4N by Intel and EP3SE260F1517I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE260F1517C4N | EP3SE260F1517I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Series | Stratix® III E | — |
| Family | Field-Programmable Gate Array (FPGA) | Stratix® III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory | 16,672,768 bits | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Maximum User I/Os | 976 | — |
| Package | 1517-BBGA, FCBGA | 1517-ball FC-FBGA |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C to 85°C | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Maximum Transceiver Data Rate | 12.5 Gbps | — |
| Embedded Memory Bits | — | 16,672,768 bits |
| User I/O Count | — | 976 |
| Process Technology | — | 65 nm |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Industrial (I): -40 °C to +100 °C |
| Operating Junction Temperature | — | -40 °C to +100 °C |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |
| Lead-Free | — | Yes |
| Internal Logic Performance | — | Up to 500 MHz |
| Memory Subsystems | — | M9K + M144K block RAM, DDR2/DDR3/QDR II+ controllers |
| DSP Blocks | — | Yes (dedicated multiply-accumulate) |