EP3SE50F484C3G vs EP3SE50F484C3N Comparison
Detailed side-by-side comparison of EP3SE50F484C3G by Intel and EP3SE50F484C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3SE50F484C3G | EP3SE50F484C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $205.00 | $832.10 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | β |
| Adaptive Logic Modules (ALMs) | 19,000 | 18,750 |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | β |
| M9K Memory Blocks | 320 (2,304 Kbits) | β |
| M144K Memory Blocks | 12 (1,728 Kbits) | β |
| User I/O Pins | 296 | β |
| 18x18 Multipliers | 384 | β |
| PLLs | 4 | β |
| Global Clock Networks | 16 | β |
| Package | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Speed Grade | C3 | β |
| Operating Temperature | 0C to +85C (commercial, "C") | 0C to +85 C (commercial, C suffix) |
| Process Node | 65 nm TSMC low-power | β |
| Core Voltage | 1.1 V | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free) | Lead-free (per DigiKey listing) |
| Device Logic Elements | β | 47,500 |
| Logic Array Blocks (LABs) | β | 1,900 |
| Embedded Memory (Bits) | β | 5,760,000 |
| User I/Os | β | 296 |
| Maximum Internal Frequency | β | 717 MHz (typical); 800 MHz per DigChip |
| Process Technology | β | TSMC 40 nm low-power CMOS |
| Supply Voltage | β | Core and I/O voltages per Stratix III E datasheet |
| MSL Level | β | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Configuration Mode | β | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | β | Intel Quartus II (Stratix III support) |
| Lifecycle Status | β | Obsolete (per Worldway listing 2026-04-05) |