EP3SE50F484C3G vs EP3SE50F484C3N 对比
详细并排对比 EP3SE50F484C3G 出自 Intel 和 EP3SE50F484C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE50F484C3G | EP3SE50F484C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $205.00 | $832.10 |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | — |
| Adaptive Logic Modules (ALMs) | 19,000 | 18,750 |
| Total Embedded Memory | 5,760,000 bits (5.76 Mbit) | — |
| M9K Memory Blocks | 320 (2,304 Kbits) | — |
| M144K Memory Blocks | 12 (1,728 Kbits) | — |
| User I/O Pins | 296 | — |
| 18x18 Multipliers | 384 | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| 封装 | 484-ball FCBGA (F484), 1.0 mm pitch | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Speed Grade | C3 | — |
| 工作温度 | 0C to +85C (commercial, "C") | 0C to +85 C (commercial, C suffix) |
| Process Node | 65 nm TSMC low-power | — |
| Core Voltage | 1.1 V | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | Compliant (lead-free) | Lead-free (per DigiKey listing) |
| Device Logic Elements | — | 47,500 |
| Logic Array Blocks (LABs) | — | 1,900 |
| Embedded Memory (Bits) | — | 5,760,000 |
| User I/Os | — | 296 |
| Maximum Internal Frequency | — | 717 MHz (typical); 800 MHz per DigChip |
| Process Technology | — | TSMC 40 nm low-power CMOS |
| 电源电压 | — | Core and I/O voltages per Stratix III E datasheet |
| MSL 等级 | — | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| Configuration Mode | — | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | — | Intel Quartus II (Stratix III support) |
| 生命周期状态 | — | Obsolete (per Worldway listing 2026-04-05) |