EP3SE80F1152C4 vs EP3SE110F1152C4 Comparison
Detailed side-by-side comparison of EP3SE80F1152C4 by Intel and EP3SE110F1152C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Last Time BuySpecification Comparison
| Parameter | EP3SE80F1152C4 | EP3SE110F1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last Time Buy |
| Series | Stratix III E | — |
| Family | Stratix III Enhanced | Stratix III E |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | 107,500 |
| Logic Array Blocks (LABs) | 3200 | [DATA_NEEDED: LAB count] |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm CMOS | 65 nm |
| Internal Frequency (max) | 800 MHz | — |
| Operating Temperature | 0C to +85C (Commercial) | — |
| Package | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | — |
| Mounting Type | Surface Mount | — |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | [DATA_NEEDED: 18x18 multiplier count] |
| RoHS Status | Compliant | Compliant |
| Embedded Memory | — | 8,936,448 bits |
| Maximum User I/Os | — | 744 |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |