EP3SE80F1152C4 vs EP3SE110F1152C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C4 sa pamamagitan ng Intel at EP3SE110F1152C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152C4 - Stratix III E FPGA 80K LE 1152-FBGA | Intel / Altera
EP3SE80F1152C4 ✓ NakahandaIntel
EP3SE110F1152C4 - Stratix III E FPGA 107.5K LE 1152-FCBGA | Intel
EP3SE110F1152C4 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152C4 | EP3SE110F1152C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Series | Stratix III E | — |
| Family | Stratix III Enhanced | Stratix III E |
| Device Type | FPGA | — |
| Logic Elements | 80,000 | 107,500 |
| Logic Array Blocks (LABs) | 3200 | [DATA_NEEDED: LAB count] |
| Total RAM Bits | 6,843,392 | — |
| User I/Os | 744 | — |
| Core Voltage | 1.1 V | 1.1 V |
| Process Technology | 65 nm CMOS | 65 nm |
| Internal Frequency (max) | 800 MHz | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Packhaging | 1152-ball FC-FBGA (Fine-pitch Chip-scale BGA) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Configuration Method | SRAM-based, JTAG / EPCS serial | — |
| DSP Blocks | Yes (variable-precision, 18x18 multipliers) | [DATA_NEEDED: 18x18 multiplier count] |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory | — | 8,936,448 bits |
| Maximum User I/Os | — | 744 |
| Maximum Performance | — | 450 MHz |
| Package Type | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Operating Temperature Grade | — | Commercial (C4) |
| Configuration Memory | — | SRAM-based (volatile) |
| On-chip Termination | — | Dynamic, programmable |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, HSTL, SSTL |