EP3SL200H780C4L vs EP3SL200H780I3 Comparison

Detailed side-by-side comparison of EP3SL200H780C4L by Intel and EP3SL200H780I3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL200H780C4L EP3SL200H780I3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $6,459.35 $7,980.00
Manufacturer Intel (formerly Altera) β€”
Series Stratix III Stratix III L
Device Type FPGA - Field Programmable Gate Array β€”
Logic Elements 200,000 200,000
Embedded Memory 6.5 Mbit β€”
User I/O Count 488 488
Package Type 780-ball FCBGA (FineLine BGA, HBGA) β€”
Package Code BGA-780 / PBGA780 / HBGA-780 β€”
Package Mounting Surface Mount β€”
Internal Logic Frequency up to 717 MHz (per ampheo datasheet brief) β€”
Speed Grade -4 (medium performance, commercial) β€”
Operating Temperature 0C to 85C (commercial) -40C to +100C (Industrial)
Lead-Free / Pb-Free Yes (L suffix, lead-free) β€”
RoHS Status Compliant β€”
Process Technology TSMC 40 nm 65 nm CMOS
Configuration Modes FPP, AS, PS, JTAG β€”
Family β€” Stratix III
LABs (Logic Array Blocks) β€” 8000
Total RAM Bits β€” 10,901,504 (10,900 Kb)
Number of I/O Banks β€” [DATA_NEEDED: I/O banks]
Embedded Multipliers (DSP blocks) β€” 384 (18x18)
PLLs β€” 12
Core Voltage β€” 1.1 V
Maximum Operating Frequency β€” 717 MHz
Package β€” 780-BBGA, FCBGA (HBGA-780)
Mounting Type β€” Surface Mount
Supplier Device Package β€” 780-FBGA (29x29 mm)
Lead-Free / RoHS β€” Compliant (lead-free)

Datasheets & Resources

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