EP3SL200H780C4L vs EP3SL200H780I3 Perbandingan
Perbandingan bersamaan detil EP3SL200H780C4L dari Intel dan EP3SL200H780I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C4L | EP3SL200H780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III | Stratix III L |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 200,000 | 200,000 |
| Embedded Memory | 6.5 Mbit | — |
| User I/O Count | 488 | 488 |
| Package Type | 780-ball FCBGA (FineLine BGA, HBGA) | — |
| Package Code | BGA-780 / PBGA780 / HBGA-780 | — |
| Package Mounting | Surface Mount | — |
| Internal Logic Frequency | up to 717 MHz (per ampheo datasheet brief) | — |
| Speed Grade | -4 (medium performance, commercial) | — |
| Suhu Kerja | 0C to 85C (commercial) | -40C to +100C (Industrial) |
| Lead-Free / Pb-Free | Yes (L suffix, lead-free) | — |
| Status RoHS | Compliant | — |
| Process Technology | TSMC 40 nm | 65 nm CMOS |
| Configuration Modes | FPP, AS, PS, JTAG | — |
| Family | — | Stratix III |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| PLLs | — | 12 |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 717 MHz |
| Paket | — | 780-BBGA, FCBGA (HBGA-780) |
| Tipe Mounting | — | Surface Mount |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Lead-Free / RoHS | — | Compliant (lead-free) |