EP4CE55F23C9L vs EP4CE55F23I7N Comparison
Detailed side-by-side comparison of EP4CE55F23C9L by Intel and EP4CE55F23I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE55F23C9L | EP4CE55F23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | 2,396,160 bits |
| Embedded 18x18 Multipliers | 156 | 56 |
| PLLs | 4 | 4 |
| User I/Os | 324 | — |
| Package | 484-ball FBGA (F23) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Speed Grade | C9 (fastest commercial/industrial) | — |
| Operating Temperature | -40C to +85C (industrial) | -40C to +100C (industrial, I7 grade) |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Method | SRAM-based, requires external flash | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Series | — | Cyclone IV E |
| Logic Elements | — | 55,856 |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Maximum User I/O | — | 324 |
| Process Technology | — | TSMC 60 nm low-power |
| Lead-Free / RoHS | — | Yes (lead-free finish) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Memory Interface Support | — | DDR, DDR2, QDRII |