EP4CE55F23C9L vs EP4CE55F23I7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE55F23C9L disebabkan oleh Intel dan EP4CE55F23I7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE55F23C9L | EP4CE55F23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | 2,396,160 bits |
| Embedded 18x18 Multipliers | 156 | 56 |
| PLLs | 4 | 4 |
| User I/Os | 324 | — |
| Kemasan | 484-ball FBGA (F23) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Speed Grade | C9 (fastest commercial/industrial) | — |
| Suhu Operasi | -40C to +85C (industrial) | -40C to +100C (industrial, I7 grade) |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Method | SRAM-based, requires external flash | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Series | — | Cyclone IV E |
| Logic Elements | — | 55,856 |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Maximum User I/O | — | 324 |
| Process Technology | — | TSMC 60 nm low-power |
| Lead-Free / RoHS | — | Yes (lead-free finish) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Memory Interface Support | — | DDR, DDR2, QDRII |