EP4CE55F23C9L vs EP4CE55F23I7N Perbandingan
Perbandingan bersamaan detil EP4CE55F23C9L dari Intel dan EP4CE55F23I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F23C9L | EP4CE55F23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,396,160 bits (2.5 Mbit) | 2,396,160 bits |
| Embedded 18x18 Multipliers | 156 | 56 |
| PLLs | 4 | 4 |
| User I/Os | 324 | — |
| Paket | 484-ball FBGA (F23) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Speed Grade | C9 (fastest commercial/industrial) | — |
| Suhu Kerja | -40C to +85C (industrial) | -40C to +100C (industrial, I7 grade) |
| Process Node | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Configuration Method | SRAM-based, requires external flash | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Level MSL | [DATA_NEEDED: MSL level] | — |
| Hard PCIe Blocks | 0 (soft PCIe via fabric) | — |
| Series | — | Cyclone IV E |
| Logic Elements | — | 55,856 |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Maximum User I/O | — | 324 |
| Process Technology | — | TSMC 60 nm low-power |
| Lead-Free / RoHS | — | Yes (lead-free finish) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Memory Interface Support | — | DDR, DDR2, QDRII |