EP4CE75F23I7N vs EP4CE75F23C6 Comparison
Detailed side-by-side comparison of EP4CE75F23I7N by Intel and EP4CE75F23C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE75F23I7N | EP4CE75F23C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $118.00 | $92.00 |
| Product Line | Cyclone IV E | โ |
| Family | Cyclone IV E (EP4CE) | Cyclone IV E (EP4CE75) |
| Logic Elements (LEs) | 75,408 | โ |
| Logic Array Blocks (LABs) | 4,713 | 4,713 |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | โ |
| Distributed RAM Bits | 200 Kbits | โ |
| Embedded 18x18 Multipliers | 15 | โ |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock network count] | โ |
| Maximum User I/Os | 292 | 292 |
| Core Voltage (VCCINT) | 1.2 V nominal | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | โ |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Package | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 484-FBGA (F23), 23x23 mm, 1.0 mm pitch |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | โ |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | โ |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | โ |
| Design Software | Quartus II / Quartus Prime | โ |
| RoHS Status | Compliant | Compliant |
| Series | โ | Cycloneยฎ IV E |
| Logic Elements | โ | 75,408 |
| Total RAM Bits | โ | 2,810,880 (~274 Kb) |
| Embedded Multipliers (18x18) | โ | 274 |
| Pin Count | โ | 484 |
| Mounting Type | โ | Surface Mount |
| Operating Temperature | โ | 0C to +85C (commercial) |
| Configuration Mode | โ | JTAG, Active Serial, Passive Serial |