EP4CE75F23I7N vs EP4CE75F23C6 Comparación
Comparación detallada lado a lado de EP4CE75F23I7N por Intel y EP4CE75F23C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE75F23I7N | EP4CE75F23C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $118,00 | $92,00 |
| Product Line | Cyclone IV E | — |
| Family | Cyclone IV E (EP4CE) | Cyclone IV E (EP4CE75) |
| Logic Elements (LEs) | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | 4,713 |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | — |
| Distributed RAM Bits | 200 Kbits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Maximum User I/Os | 292 | 292 |
| Core Voltage (VCCINT) | 1.2 V nominal | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Encapsulado | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 484-FBGA (F23), 23x23 mm, 1.0 mm pitch |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | — |
| Design Software | Quartus II / Quartus Prime | — |
| Estado RoHS | Compliant | Compliant |
| Series | — | Cyclone® IV E |
| Logic Elements | — | 75,408 |
| Total RAM Bits | — | 2,810,880 (~274 Kb) |
| Embedded Multipliers (18x18) | — | 274 |
| Recuento de pines | — | 484 |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Configuration Mode | — | JTAG, Active Serial, Passive Serial |