EP4CE75F23I7N vs EP4CE75F23C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE75F23I7N sa pamamagitan ng Intel at EP4CE75F23C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE75F23I7N | EP4CE75F23C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Product Line | Cyclone IV E | — |
| Family | Cyclone IV E (EP4CE) | Cyclone IV E (EP4CE75) |
| Logic Elements (LEs) | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | 4,713 |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | — |
| Distributed RAM Bits | 200 Kbits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Maximum User I/Os | 292 | 292 |
| Core Voltage (VCCINT) | 1.2 V nominal | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Packhaging | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 484-FBGA (F23), 23x23 mm, 1.0 mm pitch |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | — |
| Design Software | Quartus II / Quartus Prime | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone® IV E |
| Logic Elements | — | 75,408 |
| Total RAM Bits | — | 2,810,880 (~274 Kb) |
| Embedded Multipliers (18x18) | — | 274 |
| Bilang ng Pin | — | 484 |
| Uri ng Pagpapasok | — | Surface Mount |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| Configuration Mode | — | JTAG, Active Serial, Passive Serial |