EP4CGX110CF23I7N vs EP4CGX110CF23C8N Comparison
Detailed side-by-side comparison of EP4CGX110CF23I7N by Intel and EP4CGX110CF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX110CF23I7N | EP4CGX110CF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 109,424 | 109,424 |
| Configurable Logic Blocks (CLBs / LABs) | 6,839 | — |
| Embedded Memory | 5,621,760 bits | — |
| User I/O Count | 270 | 270 |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 60 nm | — |
| Package | FBGA-484 (484-pin FineLine BGA) | 484-ball FBGA (F23) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Speed Grade | I7 (industrial, balance of speed and power) | C8 |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Operating Temperature | -40 °C to +100 °C (industrial, inferred from 'I') | 0 C to 85 C (commercial) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Array Blocks (LABs) | — | 6,839 |
| Embedded Memory (bits) | — | 5,621,760 |
| Transceivers | — | 4 channels |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Core Voltage | — | 1.2 V |
| RoHS Status | — | Compliant |
| Lead-Free | — | Yes |
| MSL Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |