EP4CGX110CF23I7N vs EP4CGX110CF23C8N Vergleich
Detaillierter Direktvergleich von EP4CGX110CF23I7N von Intel und EP4CGX110CF23C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110CF23I7N | EP4CGX110CF23C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.650,08 | $170,45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 109,424 | 109,424 |
| Configurable Logic Blocks (CLBs / LABs) | 6,839 | — |
| Embedded Memory | 5,621,760 bits | — |
| User I/O Count | 270 | 270 |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 60 nm | — |
| Gehäuse | FBGA-484 (484-pin FineLine BGA) | 484-ball FBGA (F23) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Speed Grade | I7 (industrial, balance of speed and power) | C8 |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Betriebstemperatur | -40 °C to +100 °C (industrial, inferred from 'I') | 0 C to 85 C (commercial) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Array Blocks (LABs) | — | 6,839 |
| Embedded Memory (bits) | — | 5,621,760 |
| Transceivers | — | 4 channels |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Core Voltage | — | 1.2 V |
| RoHS-Status | — | Compliant |
| Lead-Free | — | Yes |
| MSL-Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |