EP4CGX150CF23C8 vs EP4CGX110CF23C8N Comparison
Detailed side-by-side comparison of EP4CGX150CF23C8 by Intel and EP4CGX110CF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP4CGX150CF23C8 - Cyclone IV GX FPGA, 150K LE, 484-BGA | Intel / Altera
EP4CGX150CF23C8 ✓ Active
Specification Comparison
| Parameter | EP4CGX150CF23C8 | EP4CGX110CF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 109,424 |
| Logic Array Blocks (LABs) | 9,360 | 6,839 |
| Embedded Memory Bits | 6,635,520 (720 Kbits of M9K memory blocks) | — |
| Embedded Multipliers (18x18) | 360 | — |
| User I/Os | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 4 channels |
| PLLs | 4 general-purpose PLLs | — |
| PCIe Hard IP | Yes, PCIe Gen1 (x1, x2, x4) | — |
| Core Voltage | 1.0 V or 1.2 V | 1.2 V |
| Speed Grade | C8 (commercial, -8 speed bin) | C8 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to 85 C (commercial) |
| Package | 484-ball FineLine BGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Lead-Free | — | Yes |
| MSL Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |