EP4CGX150CF23C8 vs EP4CGX110CF23C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX150CF23C8 sa pamamagitan ng Intel at EP4CGX110CF23C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX150CF23C8 - Cyclone IV GX FPGA, 150K LE, 484-BGA | Intel / Altera
EP4CGX150CF23C8 ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP4CGX150CF23C8 | EP4CGX110CF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 109,424 |
| Logic Array Blocks (LABs) | 9,360 | 6,839 |
| Embedded Memory Bits | 6,635,520 (720 Kbits of M9K memory blocks) | — |
| Embedded Multipliers (18x18) | 360 | — |
| User I/Os | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 4 channels |
| PLLs | 4 general-purpose PLLs | — |
| PCIe Hard IP | Yes, PCIe Gen1 (x1, x2, x4) | — |
| Core Voltage | 1.0 V or 1.2 V | 1.2 V |
| Speed Grade | C8 (commercial, -8 speed bin) | C8 |
| Temperature na Operasyon | 0 C to +85 C (commercial) | 0 C to 85 C (commercial) |
| Packhaging | 484-ball FineLine BGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Lead-Free | — | Yes |
| Level ng MSL | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |