EP4CGX150CF23C8 vs EP4CGX110CF23C8N 对比
详细并排对比 EP4CGX150CF23C8 出自 Intel 和 EP4CGX110CF23C8N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4CGX150CF23C8 | EP4CGX110CF23C8N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $135.00 | $170.45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 109,424 |
| Logic Array Blocks (LABs) | 9,360 | 6,839 |
| Embedded Memory Bits | 6,635,520 (720 Kbits of M9K memory blocks) | — |
| Embedded Multipliers (18x18) | 360 | — |
| User I/Os | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 4 channels |
| PLLs | 4 general-purpose PLLs | — |
| PCIe Hard IP | Yes, PCIe Gen1 (x1, x2, x4) | — |
| Core Voltage | 1.0 V or 1.2 V | 1.2 V |
| Speed Grade | C8 (commercial, -8 speed bin) | C8 |
| 工作温度 | 0 C to +85 C (commercial) | 0 C to 85 C (commercial) |
| 封装 | 484-ball FineLine BGA (F23) | 484-ball FBGA (F23) |
| Process Technology | 60 nm low-power CMOS | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS 状态 | Compliant | Compliant |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Lead-Free | — | Yes |
| MSL 等级 | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |