EP4CGX50DF23C8N vs EP4CGX50DF23C6N Comparison
Detailed side-by-side comparison of EP4CGX50DF23C8N by Intel and EP4CGX50DF23C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX50DF23C8N | EP4CGX50DF23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Package | 484-ball FBGA (DF23) | — |
| Ball Pitch | 1.00 mm | — |
| Seated Height | 2.40 mm | — |
| Terminal Form | Ball | — |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial |
| Configuration Modes | JTAG, Passive Serial, Active Serial | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| MSL Level | 3 (168 hours) | — |
| RoHS Status | Compliant | — |
| Embedded Memory | — | 2,340 Kbits |
| Core Voltage | — | 1.2 V |
| Number of Pins / Balls | — | 484 |
| Package Type | — | 484-ball FBGA (PBGA) |
| JEDEC Package Code | — | S-PBGA-B484 |
| User I/O | — | 218 |
| Transceiver Channels | — | Up to 8 |
| Maximum Transceiver Data Rate | — | 3.125 Gbps |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |