EP4CGX50DF23C8N vs EP4CGX50DF23C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF23C8N sa pamamagitan ng Intel at EP4CGX50DF23C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX50DF23C8N - 49,888 Cells Cyclone IV GX FPGA, 484-FBGA | Intel
EP4CGX50DF23C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX50DF23C8N | EP4CGX50DF23C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Packhaging | 484-ball FBGA (DF23) | — |
| Ball Pitch | 1.00 mm | — |
| Seated Height | 2.40 mm | — |
| Terminal Form | Ball | — |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial |
| Configuration Modes | JTAG, Passive Serial, Active Serial | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | — |
| Embedded Memory | — | 2,340 Kbits |
| Core Voltage | — | 1.2 V |
| Number of Pins / Balls | — | 484 |
| Package Type | — | 484-ball FBGA (PBGA) |
| JEDEC Package Code | — | S-PBGA-B484 |
| User I/O | — | 218 |
| Transceiver Channels | — | Up to 8 |
| Maximum Transceiver Data Rate | — | 3.125 Gbps |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |