EP4CGX50DF23C8N vs EP4CGX50DF23C6N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF23C8N von Intel und EP4CGX50DF23C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF23C8N | EP4CGX50DF23C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $56,40 | $52,30 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Gehäuse | 484-ball FBGA (DF23) | — |
| Ball Pitch | 1.00 mm | — |
| Seated Height | 2.40 mm | — |
| Terminal Form | Ball | — |
| Operating Temperature Grade | Commercial (0C to +85C) | Commercial |
| Configuration Modes | JTAG, Passive Serial, Active Serial | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | — |
| Embedded Memory | — | 2,340 Kbits |
| Core Voltage | — | 1.2 V |
| Number of Pins / Balls | — | 484 |
| Package Type | — | 484-ball FBGA (PBGA) |
| JEDEC Package Code | — | S-PBGA-B484 |
| User I/O | — | 218 |
| Transceiver Channels | — | Up to 8 |
| Maximum Transceiver Data Rate | — | 3.125 Gbps |
| Configuration Method | — | JTAG / Passive Serial / Active Serial |