EP4SGX530HH35C4 vs EP4SGX530HH35I3N Comparison
Detailed side-by-side comparison of EP4SGX530HH35C4 by Intel and EP4SGX530HH35I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4SGX530HH35C4 | EP4SGX530HH35I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3,120.00 | $3,200.00 |
| Series | Stratix IV GX | β |
| Device Type | FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | 21,248 |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Maximum User I/O Pins | 564 | β |
| Process Technology | 40 nm | β |
| Core Supply Voltage | 0.9 V | β |
| Package | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch |
| Speed Grade | HH35 | β |
| Operating Temperature | 0 C to 85 C (Commercial, -C4 suffix) | -40C to +85C (industrial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | 24 channels |
| DSP Blocks | [DATA_NEEDED: block count for this density] | 1,024 (18x18 multipliers) |
| PLLs | 8 fractional PLLs | 8 (fractional support) |
| Mounting Type | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| MSL Level | MSL3 (per BGA package standard) | 3 |
| RoHS Status | Compliant | Compliant |
| Family | β | Stratix IV GX |
| Logic Blocks / LABs | β | 21,248 |
| Maximum User I/Os | β | 564 |
| Transceiver Data Rate (max) | β | 8.5 Gbps |
| Internal Frequency (max) | β | 800 MHz |
| Lead-Free | β | Yes |
| Process Node | β | 40 nm |