EP4SGX530HH35C4 vs EP4SGX530HH35I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX530HH35C4 sa pamamagitan ng Intel at EP4SGX530HH35I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX530HH35C4 | EP4SGX530HH35I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix IV GX | — |
| Device Type | FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | 21,248 |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Packhaging | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch |
| Speed Grade | HH35 | — |
| Temperature na Operasyon | 0 C to 85 C (Commercial, -C4 suffix) | -40C to +85C (industrial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | 24 channels |
| DSP Blocks | [DATA_NEEDED: block count for this density] | 1,024 (18x18 multipliers) |
| PLLs | 8 fractional PLLs | 8 (fractional support) |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Level ng MSL | MSL3 (per BGA package standard) | 3 |
| Tindminan RoHS | Compliant | Compliant |
| Family | — | Stratix IV GX |
| Logic Blocks / LABs | — | 21,248 |
| Maximum User I/Os | — | 564 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Internal Frequency (max) | — | 800 MHz |
| Lead-Free | — | Yes |
| Process Node | — | 40 nm |