EP4SGX530HH35C4 vs EP4SGX530HH35I3N Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35C4 von Intel und EP4SGX530HH35I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35C4 | EP4SGX530HH35I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.120,00 | $3.200,00 |
| Series | Stratix IV GX | — |
| Device Type | FPGA | FPGA - Field Programmable Gate Array |
| Logic Elements | 531,200 | 531,200 |
| Adaptive Logic Modules (ALMs) | 21,248 LABs / 212,480 equivalent LEs | 21,248 |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Maximum User I/O Pins | 564 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Gehäuse | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) | 1152-ball FCBGA (HBGA), 42.5 x 42.5 mm, 1.0 mm pitch |
| Speed Grade | HH35 | — |
| Betriebstemperatur | 0 C to 85 C (Commercial, -C4 suffix) | -40C to +85C (industrial) |
| Transceivers | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] | 24 channels |
| DSP Blocks | [DATA_NEEDED: block count for this density] | 1,024 (18x18 multipliers) |
| PLLs | 8 fractional PLLs | 8 (fractional support) |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| MSL-Level | MSL3 (per BGA package standard) | 3 |
| RoHS-Status | Compliant | Compliant |
| Family | — | Stratix IV GX |
| Logic Blocks / LABs | — | 21,248 |
| Maximum User I/Os | — | 564 |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Internal Frequency (max) | — | 800 MHz |
| Lead-Free | — | Yes |
| Process Node | — | 40 nm |