EPF10K100EBC356-1X vs EPF10K100EBC356-1 Comparison

Detailed side-by-side comparison of EPF10K100EBC356-1X by Intel and EPF10K100EBC356-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-1X EPF10K100EBC356-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Series FLEX 10KE —
Logic Elements 4,992 4,992
Typical Gates 100,000 —
Logic Array Blocks (LABs) 624 —
Embedded Array Blocks (EABs) 12 —
Total RAM Bits 49,152 —
User I/O Count 274 —
Propagation Delay 0.6 ns 0.6 ns
Logic Family CMOS CMOS
Core Process Technology 0.22 um CMOS, 5 metal layers —
Core Supply Voltage 2.5 V (2.375 V to 2.625 V) —
I/O Supply Voltage 3.3 V (multi-volt tolerant to 5 V) —
Operating Temperature 0 C to +70 C (Commercial) 0 °C to 70 °C
Package Type 356-LBGA (BGA-356) —
Package Dimensions 35 x 35 mm, 1.27 mm ball pitch —
Speed Grade -1X —
Mounting Type Surface Mount (BGA) Surface Mount
Configuration Method Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) —
RoHS Status [DATA_NEEDED: RoHS status] Unknown - pre-RoHS design
MSL Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL level]
Family — FLEX 10KE
System Gates — 100,000
Embedded Memory — 49,152 bits
User I/Os — 274
Package — 356-LBGA
Process Technology — 0.22 µm CMOS
Core Voltage — 2.5 V
I/O Voltage — 2.5 V / 3.3 V
Internal Frequency — 333.33 MHz
JTAG (IEEE 1149.1) — Yes

Datasheets & Resources

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