EPF10K100EBC356-1X vs EPF10K100EBC356-1 Comparación
Comparación detallada lado a lado de EPF10K100EBC356-1X por Intel y EPF10K100EBC356-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K100EBC356-1X | EPF10K100EBC356-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $165,00 | $92,00 |
| Series | FLEX 10KE | — |
| Logic Elements | 4,992 | 4,992 |
| Typical Gates | 100,000 | — |
| Logic Array Blocks (LABs) | 624 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Logic Family | CMOS | CMOS |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Temperatura de funcionamiento | 0 C to +70 C (Commercial) | 0 °C to 70 °C |
| Package Type | 356-LBGA (BGA-356) | — |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Unknown - pre-RoHS design |
| Nivel MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Family | — | FLEX 10KE |
| System Gates | — | 100,000 |
| Embedded Memory | — | 49,152 bits |
| User I/Os | — | 274 |
| Encapsulado | — | 356-LBGA |
| Process Technology | — | 0.22 µm CMOS |
| Core Voltage | — | 2.5 V |
| I/O Voltage | — | 2.5 V / 3.3 V |
| Internal Frequency | — | 333.33 MHz |
| JTAG (IEEE 1149.1) | — | Yes |