EPF10K100EBC356-1X vs EPF10K100EBC356-1 Comparaison
Comparaison détaillée côte à côte de EPF10K100EBC356-1X par Intel et EPF10K100EBC356-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K100EBC356-1X | EPF10K100EBC356-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $165,00 | $92,00 |
| Series | FLEX 10KE | — |
| Logic Elements | 4,992 | 4,992 |
| Typical Gates | 100,000 | — |
| Logic Array Blocks (LABs) | 624 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Logic Family | CMOS | CMOS |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Température de fonctionnement | 0 C to +70 C (Commercial) | 0 °C to 70 °C |
| Package Type | 356-LBGA (BGA-356) | — |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Unknown - pre-RoHS design |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Family | — | FLEX 10KE |
| System Gates | — | 100,000 |
| Embedded Memory | — | 49,152 bits |
| User I/Os | — | 274 |
| Boîtier | — | 356-LBGA |
| Process Technology | — | 0.22 µm CMOS |
| Core Voltage | — | 2.5 V |
| I/O Voltage | — | 2.5 V / 3.3 V |
| Internal Frequency | — | 333.33 MHz |
| JTAG (IEEE 1149.1) | — | Yes |