EPF10K100EBC356-1X vs EPF10K130EBC356-1X Comparison
Detailed side-by-side comparison of EPF10K100EBC356-1X by Intel and EPF10K130EBC356-1X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K130EBC356-1X - FLEX 10KE FPGA 130K Gates BGA-356 | Intel / Altera
EPF10K130EBC356-1X ObsoleteSpecification Comparison
| Parameter | EPF10K100EBC356-1X | EPF10K130EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | Obsolete |
| Series | FLEX 10KE | FLEX 10KE |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | — |
| Logic Array Blocks (LABs) | 624 | 832 |
| Embedded Array Blocks (EABs) | 12 | Yes (RAM/ROM/FIFO) |
| Total RAM Bits | 49,152 | — |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | 2.5 V (2.375 V - 2.625 V) |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to 70 C (commercial) |
| Package Type | 356-LBGA (BGA-356) | — |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | FLEX 10KE (embedded programmable logic) |
| Logic Cells | — | 6,656 |
| System Gates | — | 130,000 |
| User I/Os | — | 274 |
| Max Internal Frequency | — | 333.33 MHz |
| Process Technology | — | 0.22 um CMOS |
| Package | — | 356-LBGA (35x35 mm) |
| Configuration Memory | — | SRAM (external config EPROM required) |