EPF10K100EBC356-1X vs EPF10K130EBC356-1X 对比

详细并排对比 EPF10K100EBC356-1X 出自 Intel 和 EPF10K130EBC356-1X 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K100EBC356-1X EPF10K130EBC356-1X
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $165.00 $132.00
Series FLEX 10KE FLEX 10KE
Logic Elements 4,992 —
Typical Gates 100,000 —
Logic Array Blocks (LABs) 624 832
Embedded Array Blocks (EABs) 12 Yes (RAM/ROM/FIFO)
Total RAM Bits 49,152 —
User I/O Count 274 —
Propagation Delay 0.6 ns 0.6 ns
Logic Family CMOS —
Core Process Technology 0.22 um CMOS, 5 metal layers —
Core Supply Voltage 2.5 V (2.375 V to 2.625 V) 2.5 V (2.375 V - 2.625 V)
I/O Supply Voltage 3.3 V (multi-volt tolerant to 5 V) —
工作温度 0 C to +70 C (Commercial) 0 C to 70 C (commercial)
Package Type 356-LBGA (BGA-356) —
Package Dimensions 35 x 35 mm, 1.27 mm ball pitch —
Speed Grade -1X —
安装类型 Surface Mount (BGA) Surface Mount (BGA)
Configuration Method Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
MSL 等级 [DATA_NEEDED: MSL rating] —
Family — FLEX 10KE (embedded programmable logic)
Logic Cells — 6,656
System Gates — 130,000
User I/Os — 274
Max Internal Frequency — 333.33 MHz
Process Technology — 0.22 um CMOS
封装 — 356-LBGA (35x35 mm)
Configuration Memory — SRAM (external config EPROM required)

数据手册与资源

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