EPF10K100EBC356-3 vs EPF10K100EBC356-2 Comparison

Detailed side-by-side comparison of EPF10K100EBC356-3 by Intel and EPF10K100EBC356-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EBC356-3 EPF10K100EBC356-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $62.50 $59.95
Family FLEX-10KE Embedded Programmable Logic Device (PLD)
Logic Elements / Cells 4,992 β€”
Total Gates ~100,000 β€”
Logic Array Blocks (LABs) 624 β€”
Embedded Memory (RAM bits) 49,152 β€”
User I/Os 274 β€”
Supply Voltage (Core) 2.5 V (2.375 V to 2.625 V) 2.375 V to 2.625 V (2.5 V nominal)
Speed Grade -3 -2
Propagation Delay (typical) 0.6 ns β€”
Maximum Internal Frequency 200 MHz β€”
Process Technology 0.22 micron CMOS CMOS, SRAM-based
Configuration Technology SRAM (volatile) β€”
Operating Temperature 0 C to 70 C (Commercial) 0 C to 70 C (Commercial)
Package 356-LBGA (35 x 35 mm) β€”
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Series β€” FLEX-10KE
Typical Gates β€” 100,000
Maximum System Gates β€” 158,000
Logic Elements (LEs) β€” 4,992
Number of LABs/CLBs β€” 624
Embedded Array Blocks (EABs) β€” 12
Total RAM Bits β€” 49,152
User I/O Pins β€” 274
Propagation Delay (tPD) β€” 0.5 ns
Internal Operating Frequency β€” up to 250 MHz
Package Type β€” 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Configuration Method β€” SRAM, JTAG (IEEE 1149.1)
Lead-Free β€” [DATA_NEEDED: lead-free status]

Datasheets & Resources

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