EPF10K100EBC356-3 vs EPF10K100EBC356-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EBC356-3 sa pamamagitan ng Intel at EPF10K100EBC356-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K100EBC356-3 EPF10K100EBC356-2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX-10KE Embedded Programmable Logic Device (PLD)
Logic Elements / Cells 4,992 —
Total Gates ~100,000 —
Logic Array Blocks (LABs) 624 —
Embedded Memory (RAM bits) 49,152 —
User I/Os 274 —
Supply Voltage (Core) 2.5 V (2.375 V to 2.625 V) 2.375 V to 2.625 V (2.5 V nominal)
Speed Grade -3 -2
Propagation Delay (typical) 0.6 ns —
Maximum Internal Frequency 200 MHz —
Process Technology 0.22 micron CMOS CMOS, SRAM-based
Configuration Technology SRAM (volatile) —
Temperature na Operasyon 0 C to 70 C (Commercial) 0 C to 70 C (Commercial)
Packhaging 356-LBGA (35 x 35 mm) —
Uri ng Pagpapasok Surface Mount Surface Mount
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Series — FLEX-10KE
Typical Gates — 100,000
Maximum System Gates — 158,000
Logic Elements (LEs) — 4,992
Number of LABs/CLBs — 624
Embedded Array Blocks (EABs) — 12
Total RAM Bits — 49,152
User I/O Pins — 274
Propagation Delay (tPD) — 0.5 ns
Internal Operating Frequency — up to 250 MHz
Package Type — 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Configuration Method — SRAM, JTAG (IEEE 1149.1)
Lead-Free — [DATA_NEEDED: lead-free status]

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita