EPF10K100EFC256-3 vs EPF10K100EFC256-2 Comparison

Detailed side-by-side comparison of EPF10K100EFC256-3 by Intel and EPF10K100EFC256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EFC256-3 EPF10K100EFC256-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $23.10 $165.00
Family FLEX 10KE β€”
Logic Elements 4,992 β€”
System Gates 100,000 (typical) β€”
Embedded RAM Bits 49,152 bits β€”
Maximum User I/Os 191 β€”
Logic Array Blocks (LABs) 624 β€”
Maximum Internal Frequency 200 MHz β€”
Propagation Delay 0.6 ns β€”
Process Technology 0.22 micron CMOS 0.22 Β΅m CMOS SRAM
Core Supply Voltage 2.5 V β€”
I/O Supply Voltage 3.3 V β€”
Logic Family CMOS CMOS (SRAM-based)
Package 256-ball FBGA (FineLine BGA) 256-FBGA (FineLine BGA, 17 x 17 mm)
Operating Temperature 0C to +70C (commercial) 0 Β°C to +70 Β°C (Commercial)
Speed Grade -3 (faster) β€”
JTAG Support IEEE 1149.1-1990 compliant β€”
PCI Compliance PCI Local Bus Specification Rev 2.2 at 33/66 MHz β€”
Series β€” FLEX 10KE
Manufacturer β€” Intel (formerly Altera)
Logic Elements / Cells β€” 4,992 (49,152 user logic elements)
Number of LABs β€” 624
User I/Os β€” 191
Total RAM Bits β€” [DATA_NEEDED: total EAB RAM bits]
Number of Gates β€” 100,000 equivalent
Core Supply Voltage (VCCINT) β€” 2.375 V to 2.625 V
Propagation Delay (per LUT) β€” ~0.6 ns (speed grade -2)
Mounting Type β€” Surface Mount (BGA)
Configuration Method β€” PS, JTAG, in-system programmable
RoHS Status β€” [DATA_NEEDED: RoHS compliance]
Embedded Array Blocks β€” Yes (EAB for RAM/ROM/DSP)

Datasheets & Resources

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