EPF10K100EFI484-2 vs EPF10K100EFC484-3N Comparison

Detailed side-by-side comparison of EPF10K100EFI484-2 by Intel and EPF10K100EFC484-3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K100EFI484-2 EPF10K100EFC484-3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $92.00 $142.00
Series FLEX 10KE β€”
Family FLEX 10KE FLEX 10KE
Manufacturer Intel (formerly Altera) β€”
Logic Elements / Cells 4,992 4992
Total System Gates 100,000 β€”
Logic Array Blocks (LABs) 624 624
Embedded Memory (bits) 49,152 β€”
User I/Os 338 338
Number of I/O Banks [DATA_NEEDED: I/O banks] β€”
Package 484-FBGA (FineLine BGA) 484-ball FineLine BGA (FC484 / FBGA-484)
Operating Temperature 0 Β°C to +70 Β°C β€”
Core Supply Voltage 2.5 V β€”
I/O Supply Voltage 3.3 V β€”
Process Technology 0.25 Β΅m CMOS SRAM 0.22 Β΅m CMOS
Propagation Delay 0.6 ns β€”
Maximum Frequency 250 MHz β€”
Programming Method SRAM (in-system reconfigurable) β€”
JTAG Support Yes (IEEE 1149.1 boundary scan) β€”
RoHS Status Compliant β€”
Mounting Type Surface Mount Surface Mount (BGA)
Total Gates β€” 100,000
Embedded Memory (EAB) β€” 49,152 bits (12 EABs)
Core Voltage (VCCINT) β€” 2.5 V
I/O Voltage (VCCIO) β€” MultiVolt (2.5 V / 3.3 V / 5.0 V tolerant per bank)
Internal Performance β€” 200 MHz
Speed Grade β€” -3 (fastest commercial bin)
Temperature Grade β€” Commercial (0 Β°C to +70 Β°C)
Configuration Method β€” SRAM (external EPROM/Flash/JTAG required at power-up)
Lead-Free / RoHS β€” Yes (N suffix = lead-free)

Datasheets & Resources

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