EPF10K130EFC484-3N vs EPF10K200SFC484-1 Comparison

Detailed side-by-side comparison of EPF10K130EFC484-3N by Intel and EPF10K200SFC484-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K130EFC484-3N EPF10K200SFC484-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Obsolete
Series FLEX-10KE —
Number of Logic Elements / Cells 6656 —
Total RAM Bits 65536 98304
Typical Gate Count 130000 —
Number of I/O 369 —
Number of LABs/CLBs 832 1248
Number of Embedded Array Blocks (EABs) 72 —
Speed Grade -3 (faster timing bin) -1 (slowest of -1/-2/-3)
Operating Temperature Grade Commercial (0C to +70C) —
Core Voltage 2.5 V 2.5 V (2.375 V to 2.625 V)
Process Technology 0.22 µm CMOS 0.22 um CMOS
Package Type 484-BBGA (FineLine BGA) —
Package Dimensions 23 x 23 mm —
Ball Pitch 1.0 mm —
Mounting Type Surface Mount Surface Mount
Configuration Memory SRAM-based (volatile, requires config device) —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Configuration Interface JTAG / PS / PPS / Altera serial —
Family — FLEX 10KS
Logic Cells — 9984
System Gates — 200,000
Embedded RAM Bits — 98,304
Number of Logic Elements — 9984
User I/O Count — 369
Number of DLLs — 4
Operating Temperature Range — 0C to 70C (commercial)
Internal Operating Frequency — 250 MHz
Package — 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch
I/O Standards Supported — LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP

Datasheets & Resources

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