EPF10K130EFC484-3N vs EPF10K200SFC484-1 Comparaison
Comparaison détaillée côte à côte de EPF10K130EFC484-3N par Intel et EPF10K200SFC484-1 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EPF10K130EFC484-3N | EPF10K200SFC484-1 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $109,25 | $162,00 |
| Series | FLEX-10KE | — |
| Number of Logic Elements / Cells | 6656 | — |
| Total RAM Bits | 65536 | 98304 |
| Typical Gate Count | 130000 | — |
| Number of I/O | 369 | — |
| Number of LABs/CLBs | 832 | 1248 |
| Number of Embedded Array Blocks (EABs) | 72 | — |
| Speed Grade | -3 (faster timing bin) | -1 (slowest of -1/-2/-3) |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Core Voltage | 2.5 V | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS |
| Package Type | 484-BBGA (FineLine BGA) | — |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Configuration Interface | JTAG / PS / PPS / Altera serial | — |
| Family | — | FLEX 10KS |
| Logic Cells | — | 9984 |
| System Gates | — | 200,000 |
| Embedded RAM Bits | — | 98,304 |
| Number of Logic Elements | — | 9984 |
| User I/O Count | — | 369 |
| Number of DLLs | — | 4 |
| Plage de température de fonctionnement | — | 0C to 70C (commercial) |
| Internal Operating Frequency | — | 250 MHz |
| Boîtier | — | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP |