EPF10K130EFC484-3N vs EPF10K200SFC484-1 Comparación
Comparación detallada lado a lado de EPF10K130EFC484-3N por Intel y EPF10K200SFC484-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPF10K130EFC484-3N | EPF10K200SFC484-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $109,25 | $162,00 |
| Series | FLEX-10KE | — |
| Number of Logic Elements / Cells | 6656 | — |
| Total RAM Bits | 65536 | 98304 |
| Typical Gate Count | 130000 | — |
| Number of I/O | 369 | — |
| Number of LABs/CLBs | 832 | 1248 |
| Number of Embedded Array Blocks (EABs) | 72 | — |
| Speed Grade | -3 (faster timing bin) | -1 (slowest of -1/-2/-3) |
| Operating Temperature Grade | Commercial (0C to +70C) | — |
| Core Voltage | 2.5 V | 2.5 V (2.375 V to 2.625 V) |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS |
| Package Type | 484-BBGA (FineLine BGA) | — |
| Package Dimensions | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires config device) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Configuration Interface | JTAG / PS / PPS / Altera serial | — |
| Family | — | FLEX 10KS |
| Logic Cells | — | 9984 |
| System Gates | — | 200,000 |
| Embedded RAM Bits | — | 98,304 |
| Number of Logic Elements | — | 9984 |
| User I/O Count | — | 369 |
| Number of DLLs | — | 4 |
| Rango de temperatura de funcionamiento | — | 0C to 70C (commercial) |
| Internal Operating Frequency | — | 250 MHz |
| Encapsulado | — | 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, AGP |