EPF10K200EBC600-1 vs EPF10K200EBI600-2 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-1 by Intel and EPF10K200EBI600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-1 EPF10K200EBI600-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Product Type Field Programmable Gate Array (FPGA) —
Device Family FLEX-10KE —
Logic Elements 9,984 —
Embedded Memory 98,304 bits —
Logic Array Blocks 1,248 LABs —
I/O Count 470 I/O —
Supply Voltage 2.5 V —
Package 600-BGA BGA-600, 45 x 45 mm, 1.27 mm pitch
Technology Mixed CMOS —
Commercial Temperature 85 C —
Propagation Delay 0.4 ns 0.4 ns (per -2 speed grade)
Embedded Array Enhanced embedded array —
Memory Feature Dual-port memory —
RoHS Status unknown Compliant (lead-free package)
Configuration Interface [DATA_NEEDED: configuration interface] —
Package Dimensions [DATA_NEEDED: package dimensions] —
Operating Current [DATA_NEEDED: operating current] —
Pinout [DATA_NEEDED: 600-BGA ball map] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — FLEX 10KE
System Gates — 200,000
Logic Elements (LEs) — 9,984
Logic Array Blocks (LABs) — 1,248
Embedded RAM — 98,304 bits
Embedded Array Blocks (EABs) — 12 (typical for this density)
User I/O Pins — 470
Supply Voltage (VCCINT) — 2.5 V
Operating Temperature — 0 C to 70 C (commercial)
Logic Family — CMOS, SRAM-based
Mounting Type — Surface Mount (BGA)
Configuration Method — JTAG / ByteBlaster (SRAM configuration)

Datasheets & Resources

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