EPF10K200EBC600-1 vs EPF10K200EBI600-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-1 sa pamamagitan ng Intel at EPF10K200EBI600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EBC600-1 EPF10K200EBI600-2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Product Type Field Programmable Gate Array (FPGA) —
Device Family FLEX-10KE —
Logic Elements 9,984 —
Embedded Memory 98,304 bits —
Logic Array Blocks 1,248 LABs —
I/O Count 470 I/O —
Volte ng Pagbibigay 2.5 V —
Packhaging 600-BGA BGA-600, 45 x 45 mm, 1.27 mm pitch
Technology Mixed CMOS —
Commercial Temperature 85 C —
Propagation Delay 0.4 ns 0.4 ns (per -2 speed grade)
Embedded Array Enhanced embedded array —
Memory Feature Dual-port memory —
Tindminan RoHS unknown Compliant (lead-free package)
Configuration Interface [DATA_NEEDED: configuration interface] —
Package Dimensions [DATA_NEEDED: package dimensions] —
Operating Current [DATA_NEEDED: operating current] —
Pinout [DATA_NEEDED: 600-BGA ball map] —
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Family — FLEX 10KE
System Gates — 200,000
Logic Elements (LEs) — 9,984
Logic Array Blocks (LABs) — 1,248
Embedded RAM — 98,304 bits
Embedded Array Blocks (EABs) — 12 (typical for this density)
User I/O Pins — 470
Supply Voltage (VCCINT) — 2.5 V
Temperature na Operasyon — 0 C to 70 C (commercial)
Logic Family — CMOS, SRAM-based
Uri ng Pagpapasok — Surface Mount (BGA)
Configuration Method — JTAG / ByteBlaster (SRAM configuration)

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