EPF10K200EBC600-2 vs EPF10K200EBC600-1 Comparison

Detailed side-by-side comparison of EPF10K200EBC600-2 by Intel and EPF10K200EBC600-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EBC600-2 EPF10K200EBC600-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Series FLEX-10KE —
Logic Family CMOS (SRAM-based) —
Process Technology 0.30 µm CMOS —
Typical Gate Count 200,000 gates —
Logic Elements (LEs) 9984 —
Logic Array Blocks (LABs) 1248 —
Embedded Memory (EAB) 98304 bits (96 Kbits) —
Maximum User I/O 470 pins —
Propagation Delay 0.4 ns 0.4 ns
Supply Voltage 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) 2.5 V
I/O Standards LVTTL, LVCMOS, PCI, GTL+ —
Package Type 600-ball BGA (BGA-600) —
Package Dimensions 45 × 45 mm [DATA_NEEDED: package dimensions]
Ball Pitch 1.27 mm —
Package Height 1.1 mm max —
Operating Temperature 0°C to +70°C (Commercial) —
Mounting Type Surface Mount —
Configuration Method JTAG (IEEE 1149.1), EPC2 serial PROM —
Part Status Obsolete —
RoHS Status unknown unknown
Product Type — Field Programmable Gate Array (FPGA)
Device Family — FLEX-10KE
Logic Elements — 9,984
Embedded Memory — 98,304 bits
Logic Array Blocks — 1,248 LABs
I/O Count — 470 I/O
Package — 600-BGA
Technology — Mixed CMOS
Commercial Temperature — 85 C
Embedded Array — Enhanced embedded array
Memory Feature — Dual-port memory
Configuration Interface — [DATA_NEEDED: configuration interface]
Operating Current — [DATA_NEEDED: operating current]
Pinout — [DATA_NEEDED: 600-BGA ball map]
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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