EPF10K200EBC600-2 vs EPF10K200EBC600-1 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-2 sa pamamagitan ng Intel at EPF10K200EBC600-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K200EBC600-2 EPF10K200EBC600-1
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series FLEX-10KE —
Logic Family CMOS (SRAM-based) —
Process Technology 0.30 µm CMOS —
Typical Gate Count 200,000 gates —
Logic Elements (LEs) 9984 —
Logic Array Blocks (LABs) 1248 —
Embedded Memory (EAB) 98304 bits (96 Kbits) —
Maximum User I/O 470 pins —
Propagation Delay 0.4 ns 0.4 ns
Volte ng Pagbibigay 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) 2.5 V
I/O Standards LVTTL, LVCMOS, PCI, GTL+ —
Package Type 600-ball BGA (BGA-600) —
Package Dimensions 45 × 45 mm [DATA_NEEDED: package dimensions]
Ball Pitch 1.27 mm —
Package Height 1.1 mm max —
Temperature na Operasyon 0°C to +70°C (Commercial) —
Uri ng Pagpapasok Surface Mount —
Configuration Method JTAG (IEEE 1149.1), EPC2 serial PROM —
Part Status Obsolete —
Tindminan RoHS unknown unknown
Product Type — Field Programmable Gate Array (FPGA)
Device Family — FLEX-10KE
Logic Elements — 9,984
Embedded Memory — 98,304 bits
Logic Array Blocks — 1,248 LABs
I/O Count — 470 I/O
Packhaging — 600-BGA
Technology — Mixed CMOS
Commercial Temperature — 85 C
Embedded Array — Enhanced embedded array
Memory Feature — Dual-port memory
Configuration Interface — [DATA_NEEDED: configuration interface]
Operating Current — [DATA_NEEDED: operating current]
Pinout — [DATA_NEEDED: 600-BGA ball map]
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

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