EPF10K200EBC600-2 vs EPF10K200EBC600-1 对比
详细并排对比 EPF10K200EBC600-2 出自 Intel 和 EPF10K200EBC600-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 Obsolete规格对比
| 参数 | EPF10K200EBC600-2 | EPF10K200EBC600-1 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $198.00 | $322.17 |
| Series | FLEX-10KE | — |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | — |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | — |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| 电源电压 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | 2.5 V |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | [DATA_NEEDED: package dimensions] |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 工作温度 | 0°C to +70°C (Commercial) | — |
| 安装类型 | Surface Mount | — |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | — |
| Part Status | Obsolete | — |
| RoHS 状态 | unknown | unknown |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Device Family | — | FLEX-10KE |
| Logic Elements | — | 9,984 |
| Embedded Memory | — | 98,304 bits |
| Logic Array Blocks | — | 1,248 LABs |
| I/O Count | — | 470 I/O |
| 封装 | — | 600-BGA |
| Technology | — | Mixed CMOS |
| Commercial Temperature | — | 85 C |
| Embedded Array | — | Enhanced embedded array |
| Memory Feature | — | Dual-port memory |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Operating Current | — | [DATA_NEEDED: operating current] |
| Pinout | — | [DATA_NEEDED: 600-BGA ball map] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |