EPF10K200EBC600-2 vs EPF10K200EBI600-2N Comparison

Detailed side-by-side comparison of EPF10K200EBC600-2 by Intel and EPF10K200EBI600-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K200EBI600-2N EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N - 200K Gates FLEX 10KE FPGA | Intel

EPF10K200EBI600-2N Obsolete

Specification Comparison

Parameter EPF10K200EBC600-2 EPF10K200EBI600-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Series FLEX-10KE —
Logic Family CMOS (SRAM-based) —
Process Technology 0.30 µm CMOS —
Typical Gate Count 200,000 gates —
Logic Elements (LEs) 9984 9,984
Logic Array Blocks (LABs) 1248 —
Embedded Memory (EAB) 98304 bits (96 Kbits) —
Maximum User I/O 470 pins —
Propagation Delay 0.4 ns 0.4 ns to 0.6 ns (per LE)
Supply Voltage 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) —
I/O Standards LVTTL, LVCMOS, PCI, GTL+ —
Package Type 600-ball BGA (BGA-600) —
Package Dimensions 45 × 45 mm —
Ball Pitch 1.27 mm —
Package Height 1.1 mm max —
Operating Temperature 0°C to +70°C (Commercial) 0 °C to +70 °C (commercial)
Mounting Type Surface Mount Surface Mount (BGA)
Configuration Method JTAG (IEEE 1149.1), EPC2 serial PROM SRAM, JTAG (IEEE 1149.1), serial configuration EPROM
Part Status Obsolete —
RoHS Status unknown [DATA_NEEDED: RoHS compliance status]
Family — FLEX 10KE
Typical Gates — 200,000
Maximum System Gates — 513,000
Embedded Array Blocks (EABs) — 12
Total RAM Bits — 98,304
User I/O Pins — 470
Dedicated Inputs — 6
Package — 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch)
Technology / Process — 0.22 µm CMOS SRAM
Core Supply Voltage — 2.5 V (2.3 V to 2.7 V)
I/O Supply Voltage — 2.5 V / 3.3 V (5 V tolerant I/O available)
Maximum Internal Frequency — 200 MHz
MSL Level — [DATA_NEEDED: moisture sensitivity level]

Datasheets & Resources

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