EPF10K200EBC600-2 vs EPF10K200EBI600-2N 比較
詳細な並列比較: EPF10K200EBC600-2 メーカー: Intel および EPF10K200EBI600-2N メーカー: Intel。主要仕様、電気的特性、パッケージ、ライフサイクルステータス、価格、在庫状況を比較して、設計要件に最適な部品を判断してください。
仕様比較
| パラメータ | EPF10K200EBC600-2 | EPF10K200EBI600-2N |
|---|---|---|
| ブランド | Intel | Intel |
| カテゴリ | FPGA & CPLD | FPGA & CPLD |
| ライフサイクル状態 | Obsolete | Obsolete |
| 在庫状況 | In Stock | In Stock |
| 単価（USD） | $198.00 | $140.00 |
| Series | FLEX-10KE | — |
| Logic Family | CMOS (SRAM-based) | — |
| Process Technology | 0.30 µm CMOS | — |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | 9,984 |
| Logic Array Blocks (LABs) | 1248 | — |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns to 0.6 ns (per LE) |
| 電源電圧 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 動作温度 | 0°C to +70°C (Commercial) | 0 °C to +70 °C (commercial) |
| 実装タイプ | Surface Mount | Surface Mount (BGA) |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM |
| Part Status | Obsolete | — |
| RoHS ステータス | unknown | [DATA_NEEDED: RoHS compliance status] |
| Family | — | FLEX 10KE |
| Typical Gates | — | 200,000 |
| Maximum System Gates | — | 513,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 98,304 |
| User I/O Pins | — | 470 |
| Dedicated Inputs | — | 6 |
| パッケージ | — | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) |
| Technology / Process | — | 0.22 µm CMOS SRAM |
| Core Supply Voltage | — | 2.5 V (2.3 V to 2.7 V) |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (5 V tolerant I/O available) |
| Maximum Internal Frequency | — | 200 MHz |
| MSLレベル | — | [DATA_NEEDED: moisture sensitivity level] |