EPF10K200EBI600-2N vs EPF10K200EBI600-2 Comparison
Detailed side-by-side comparison of EPF10K200EBI600-2N by Intel and EPF10K200EBI600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteSpecification Comparison
| Parameter | EPF10K200EBI600-2N | EPF10K200EBI600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | 9,984 |
| Embedded Array Blocks (EABs) | 12 | 12 (typical for this density) |
| Total RAM Bits | 98,304 | — |
| User I/O Pins | 470 | 470 |
| Dedicated Inputs | 6 | — |
| Package | 600-ball BGA (45 mm x 45 mm, 1.27 mm pitch) | BGA-600, 45 x 45 mm, 1.27 mm pitch |
| Technology / Process | 0.22 µm CMOS SRAM | — |
| Core Supply Voltage | 2.5 V (2.3 V to 2.7 V) | — |
| I/O Supply Voltage | 2.5 V / 3.3 V (5 V tolerant I/O available) | — |
| Propagation Delay | 0.4 ns to 0.6 ns (per LE) | 0.4 ns (per -2 speed grade) |
| Maximum Internal Frequency | 200 MHz | — |
| Operating Temperature | 0 °C to +70 °C (commercial) | 0 C to 70 C (commercial) |
| Configuration Method | SRAM, JTAG (IEEE 1149.1), serial configuration EPROM | JTAG / ByteBlaster (SRAM configuration) |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant (lead-free package) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| System Gates | — | 200,000 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Embedded RAM | — | 98,304 bits |
| Supply Voltage (VCCINT) | — | 2.5 V |
| Logic Family | — | CMOS, SRAM-based |