EPF10K200EFC672-1 vs EPF10K200EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-1 by Intel and EPF10K200EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF10K200EFC672-1 EPF10K200EFC672-1 - 200K Gates FLEX-10KE FPGA | Intel

EPF10K200EFC672-1 - 200K Gates FLEX-10KE FPGA | Intel

EPF10K200EFC672-1 ⚠ Last Time Buy

Specification Comparison

Parameter EPF10K200EFC672-1 EPF10K200EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Last Time Buy
Family FLEX-10KE FLEX 10KE
Logic Elements 9,984 —
Typical Gates 200,000 200,000
User I/Os 470 —
Embedded Memory (bits) 98,304 —
Logic Array Blocks (LABs) 1,248 —
Package 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch —
Process Technology CMOS, SRAM-based —
Propagation Delay 0.4 ns —
Operating Temperature 0 C to 70 C (Commercial) 0C to +70C (Commercial)
Speed Grade -1 —
Mounting Type Surface Mount Through-Hole (Socket or Solder)
I/O Standards Supported LVTTL, LVCMOS, PCI, True-LVDS —
Core Voltage 2.5 V (typical, FLEX-10KE) —
RoHS Status Compliant [DATA_NEEDED: RoHS status of ceramic CPGA variant]
Supply Voltage - Max 3.3 V (I/O) —
MSL Level 3 (168 hours) —
Logic Elements (LEs) — 9,984
Embedded Array Blocks (EABs) — 470
Total RAM Bits — 98,304
Core Supply Voltage — 2.375 V to 2.625 V
I/O Voltage Tolerance — 5.0 V tolerant
Pin Count — 599
Package Type — 599-BCPGA (Ceramic Pin Grid Array)
Package Dimensions — 62.48 x 62.48 mm
Programming Interface — JTAG (IEEE 1149.1)
PLLs — 4

Datasheets & Resources

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