EPF10K200EFC672-1 vs EPF10K200EGC599-1 Comparación
Comparación detallada lado a lado de EPF10K200EFC672-1 por Intel y EPF10K200EGC599-1 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Última compraComparación de especificaciones
| Parámetro | EPF10K200EFC672-1 | EPF10K200EGC599-1 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $198,00 | $880,00 |
| Family | FLEX-10KE | FLEX 10KE |
| Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | 200,000 |
| User I/Os | 470 | — |
| Embedded Memory (bits) | 98,304 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Encapsulado | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch | — |
| Process Technology | CMOS, SRAM-based | — |
| Propagation Delay | 0.4 ns | — |
| Temperatura de funcionamiento | 0 C to 70 C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | -1 | — |
| Tipo de montaje | Surface Mount | Through-Hole (Socket or Solder) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, True-LVDS | — |
| Core Voltage | 2.5 V (typical, FLEX-10KE) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| Supply Voltage - Max | 3.3 V (I/O) | — |
| Nivel MSL | 3 (168 hours) | — |
| Logic Elements (LEs) | — | 9,984 |
| Embedded Array Blocks (EABs) | — | 470 |
| Total RAM Bits | — | 98,304 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | — | 5.0 V tolerant |
| Recuento de pines | — | 599 |
| Package Type | — | 599-BCPGA (Ceramic Pin Grid Array) |
| Package Dimensions | — | 62.48 x 62.48 mm |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| PLLs | — | 4 |