EPF10K200EFC672-1 vs EPF10K250EFC672-1 Comparison
Detailed side-by-side comparison of EPF10K200EFC672-1 by Intel and EPF10K250EFC672-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K200EFC672-1 | EPF10K250EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Family | FLEX-10KE | FLEX 10KE |
| Logic Elements | 9,984 | — |
| Typical Gates | 200,000 | — |
| User I/Os | 470 | — |
| Embedded Memory (bits) | 98,304 | — |
| Logic Array Blocks (LABs) | 1,248 | — |
| Package | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch | — |
| Process Technology | CMOS, SRAM-based | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Operating Temperature | 0 C to 70 C (Commercial) | 0C to +70C (Commercial) |
| Speed Grade | -1 | -1 |
| Mounting Type | Surface Mount | Surface Mount |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, True-LVDS | — |
| Core Voltage | 2.5 V (typical, FLEX-10KE) | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Supply Voltage - Max | 3.3 V (I/O) | — |
| MSL Level | 3 (168 hours) | — |
| Logic Family | — | CMOS |
| Typical System Gates | — | 250,000 |
| Maximum User I/Os | — | 470 |
| Total Pins | — | 672 |
| Package Type | — | BGA-672 |
| Package Size | — | 45 x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Programming Technology | — | In-system, SRAM-based |
| Configuration Interface | — | Serial (passive/active) |