EPF10K200SBC600-1 vs EPF10K200EBC600-3 Comparison
Detailed side-by-side comparison of EPF10K200SBC600-1 by Intel and EPF10K200EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200SBC600-1 - 200K Gate FLEX-10KS FPGA, 470 I/O | Intel / Altera
EPF10K200SBC600-1 ObsoleteIntel
EPF10K200EBC600-3 - 200K Gate FLEX 10KE FPGA, 600-BGA | Intel / Altera
EPF10K200EBC600-3 ObsoleteSpecification Comparison
| Parameter | EPF10K200SBC600-1 | EPF10K200EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX-10KS | FLEX 10KE |
| Series | EPF10K200 | FLEX-10KE |
| Logic Elements / Cells | 9,984 | 9,984 |
| Gate Count (typical) | 200,000 gates | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Number of User I/Os | 470 | — |
| Number of Logic Cells | 4,992 | — |
| Embedded RAM (bits) | 24,576 (across EABs) | — |
| Max Internal Frequency | 250 MHz | — |
| Propagation Delay | 0.4 ns | — |
| Process Technology | 0.22 µm CMOS | 0.22 micrometer SRAM |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| Speed Grade | -1 (fastest commercial) | -3 (commercial) |
| Operating Temperature | 0 °C to 70 °C (Commercial) | 0C to +70C (commercial) |
| Package | 600-ball BGA, 45 × 45 mm, 1.27 mm pitch | 600-ball FineLine BGA, 45 x 45 mm |
| Mounting Type | Surface Mount | Surface Mount |
| JTAG Support | IEEE Std 1149.1 | Yes (IEEE 1149.1 boundary-scan) |
| Configuration | Serial via EPC2/EPC8 configuration devices | — |
| RoHS Status | Non-compliant (per third-party listing) | [DATA_NEEDED: RoHS compliance status] |
| System Gates | — | 200,000 |
| Embedded Memory (EABs) | — | 24,576 bits |
| Maximum User I/O | — | 470 |
| Number of PLLs | — | 4 |
| Core Voltage | — | 2.5 V (2.375 V to 2.625 V) |