EPF10K200SFC484-3 vs EPF10K200SFC484-2X Comparison

Detailed side-by-side comparison of EPF10K200SFC484-3 by Intel and EPF10K200SFC484-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200SFC484-3 EPF10K200SFC484-2X
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Series FLEX-10KS FLEX 10KS
Family FLEX 10K FLEX 10K
System Gates 200,000 —
Logic Cells 9,984 —
Logic Array Blocks (LABs) 1,248 —
User I/O Pins 369 —
Core Voltage 2.375 V to 2.625 V —
Process Technology 0.22 µm CMOS SRAM [DATA_NEEDED: process node nm]
Maximum Internal Frequency 166.67 MHz —
Embedded Memory (RAM bits) 40,960 (via EABs) —
Global Clock Networks 4 —
Package 484-Ball FineLine BGA (PBGA484) —
Package Dimensions 23 mm × 23 mm, 1.0 mm pitch —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0 °C to +70 °C (Commercial) 0C to +70C (commercial)
Configuration Method SRAM, JTAG, EPC2 PROM —
I/O Standards 3.3 V LVTTL/LVCMOS, 5.0 V PCI —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: rohs status]
Status Obsolete (last shipped 2007-2010, available via brokers) —
Number of Logic Elements / Cells — 9984
Number of LABs / CLBs — 1248
Total RAM Bits — 98304
Number of Gates — 200000 (typical)
Number of I/O — 369
Core Voltage - Supply — 2.375 V to 2.625 V
Operating Frequency (max) — 250 MHz (family-typical, -2 speed grade)
Package / Case — 484-BBGA (FineLine BGA)
Supplier Device Package — 484-FBGA (23 x 23 mm, 1.0 mm pitch)
Technology — CMOS, SRAM-based configuration
Configuration Memory — External serial (EPC1/EPC2 family compatible)
JTAG Support — IEEE 1149.1-1990 boundary-scan

Datasheets & Resources

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